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US 2020/0048414 A1Published application
Filament compositions for fused filament fabrication and methods of use thereof
AssigneeE. I. Du Pont de Nemours and Company
InventorKai Qi
Life of this patent
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Abstract
The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.
Claims13
A filament comprising a polymer composition, said polymer composition comprising:
- A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point;
- wherein said semi-aromatic copolyamide comprises
- a-1) 5 to 40 mole percent aromatic repeat units derived from:
- i) one or more aromatic dicarboxylic acids with 8 to 20 carbon atoms and an aliphatic diamine with 4 to 20 carbon atoms;
- and
- a-2) 60 to 95 mole percent aliphatic repeat units derived from:
- ii) an aliphatic dicarboxylic acid with 6 to 20 carbon atoms and an aliphatic diamine with 4 to 20 carbon atoms;
- and
- B) 5 to 45 weight percent amorphous copolyamide having a melting point;
- wherein said amorphous copolyamide comprises
- b-1) 60 to 90 mole percent aromatic repeat units derived from:
- iii) isophthalic acid and an aliphatic diamine with 4 to 20 carbon atoms;
- and
- b-2) 10 to 40 mole percent aromatic repeat units derived from:
- iv) terephthalic acid and an aliphatic diamine with 4 to 20 carbon atoms.
12 more elements
Dependencies are inferred from the claim text.