Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

A method, comprising:

• providing a body structure having an interior cavity and a control chip disposed on a first interior surface of the interior cavity;
• providing a landing pad disposed on the first interior surface and electrically connected to the control chip;
• providing a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface, the sensor having a mounting pad on a second side of the sensor that faces the first interior surface, wherein the sensor is vertically spaced apart from the control chip by an air gap, and wherein the sensor is aligned at least partially over the control chip after the sensor is provided on the second interior surface, and wherein at least a first portion of the landing pad is aligned directly under the sensor;
• and
• providing an interconnect with a first end mounted on, and in direct contact with, the mounting pad, the interconnect extending substantially vertically, with respect to the sensor, through the interior cavity toward the first interior surface, wherein all side surfaces of the interconnect are spaced apart from the interior surfaces of the interior cavity, wherein the side surfaces of the interconnect extend contiguously from the first end of the interconnect to a second end of the interconnect and are exposed to the interior cavity, and wherein the second end of the interconnect is connected to the first portion of the landing pad by a conductive connector in direct contact with the landing pad and the second end of the interconnect;
• wherein the control chip is in electrical communication with the sensor by way of the interconnect and landing pad after the sensor is provided on the second interior surface.

A method, comprising:

• providing a substrate having a first contact pad;
• proving a sidewall;
• a control chip disposed on the substrate and in electrical communication with the first contact pad;
• a landing pad disposed on the substrate and electrically connected to the control chip;
• providing a lid having a sensor attached, at a first side of the sensor, to the lid, the sensor having a mounting pad;
• providing an interconnect having a first end mounted on, and in direct contact with, the mounting pad;
• and
• attaching the lid to the substrate by the sidewall, wherein, after the attaching the lid to the substrate, the lid is separated from the substrate by an interior cavity that is bounded by the sidewall, the lid and the substrate, the sensor extending from the lid into the interior cavity after the attaching the lid, wherein, after the attaching the lid, the control chip extends from the substrate into the interior cavity, wherein the sensor is vertically spaced apart from the control chip by an air gap after the attaching the lid, wherein the sensor is aligned at least partially over the control chip after the attaching the lid, and wherein at least a first portion of the landing pad is aligned directly under the sensor after the attaching the lid;
• wherein, after the attaching the lid, the interconnect extends substantially vertically, with respect to the sensor, through the interior cavity and makes electrical contact, at a second end of the interconnect opposite the first end, with the first contact pad, wherein the interconnect is spaced apart from side surfaces of the interior cavity after the attaching the lid, wherein, after the attaching the lid, side surfaces of the interconnect extend contiguously from the first end of the interconnect to a second end of the interconnect and are exposed to the interior cavity, and wherein, after the attaching the lid, the second end of the interconnect is connected to the first portion of the landing pad by a conductive connector in direct contact with the landing pad and the second end of the interconnect.