Force sensor and manufacture method thereof

A method for manufacturing a force sensor, comprising:

• providing a third substrate and defining at least one first connection member and a pillar in the third substrate;
• providing a second substrate including a first surface and a second surface opposite to the first substrate;
• facing the second surface to the third substrate and joining the second substrate to the first connection member and the pillar of the third substrate;
• defining at least one second connection member in the first surface of the second substrate;
• defining a MEMS element in the second substrate, wherein the MEMS element is connected with the pillar;
• providing a first substrate including a fixed electrode, at least one first conductive contact and at least one second conductive contact;
• joining the first substrate to the second substrate, wherein the at least one first conductive contact is electrically connected with the at least one second connection member, and wherein the MEMS element is corresponding to the fixed electrode;
• and
• using a package body to cover the first substrate, the second substrate and the third substrate.