Micromechanical sensor that includes a stress decoupling structure
AssigneeRobert Bosch GmbH
InventorsChristoph Schelling, Jochen Beintner
Life of this patent
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Abstract
A micromechanical sensor is described that includes: a substrate; a first functional layer that is situated on the substrate; a second functional layer that is situated on the first functional layer and that includes movable micromechanical structures; a cavity in the substrate that is situated below the movable mechanical structures; and a vertical trench structure that surrounds the movable micromechanical structures of the second functional layer and extends into the substrate down to the cavity.
Claims11
-10. (canceled)
A micromechanical sensor, comprising:
- a substrate;
- a first functional layer situated on the substrate;
- a second functional layer situated on the first functional layer and including movable micromechanical structures;
- a cavity in the substrate that is situated below the movable mechanical structures;
- and
- a vertical trench structure that surrounds the movable micromechanical structures of the second functional layer and extends into the substrate down to the cavity.
A method for manufacturing a micromechanical sensor, comprising:
- providing a substrate with a cavity formed therein;
- forming a first functional layer on the substrate;
- forming a second functional layer that includes movable micromechanical structures formed in an area of the second functional layer above the cavity;
- and
- forming a vertical trench structure around the movable micromechanical structures, into the substrate down to the cavity.
Dependencies are inferred from the claim text.