Wire bundle processing method

A method of reducing entanglement of wires, comprising:

• receiving from a wire feed system of a wire processing machine a plurality of first wires of a first wire group on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire group;
• and
• receiving from the wire feed system a plurality of second wires of a second wire group at least partially on top of the first wire group, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire group and the second wire group;
• moving the second wires relative to the first wires;
• and
• reducing movement of at least some of the first wires relative to the tray surface during movement of one or more of the second wires relative to the first wires due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.