Method and device for embossing of a nanostructure
AssigneeEV Group E. Thallner GmbH
InventorGerald Kreindl
Life of this patent
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Abstract
A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.
Claims17
A method for embossing of a nanostructure to a stamp surface of a substrate, comprising:
- applying a resist onto the stamp surface of the substrate prior to an imprint operation;
- and
- embossing the nanostructure of a nanostructure stamp to the substrate in vacuum or at ambient pressure under inert gas during the imprint operation.
A device for embossing of a nanostructure from a nanostructure stamp into a stamp surface of a substrate, comprising:
- one or more pressure elements configured to prestress the nanostructure stamp during an imprint operation and make contact of a partial area of the stamp surface of the substrate with the nanostructure stamp during the imprint operation.
Dependencies are inferred from the claim text.