Apparatus and method for detecting failure in a mechanical press

Abstract

An apparatus and a method for detecting a failure in a press for punching semiconductor devices are provided, where the method comprises the steps of locating a semiconductor device between a first die-set part and a second die-set part comprised in the press, and moving the first die-set part and the second die-set part relative to each other for punching the semiconductor device therebetween. The method further comprises the steps of monitoring a parameter with a sensor attached to the first die-set part and/or the second die-set part at different positions of the first die-set part when it is moving relative to the second die set part while punching the semiconductor device, and comparing a present variation of the parameter at different positions of the first die-set part relative to the second die-set part against an expected variation of the parameter at positions of the first die-set part relative to the second die-set part during normal operation of the press when there is no failure while punching the semiconductor device. The method also comprises the step of determining that a failure has occurred in the press when the present variation of the parameter is different from the expected variation of the parameter.

Dependencies are inferred from the claim text.