Systems and methods for altering high throughput cutting of sealing elements on packages

A cutting system comprising:

• a cutting device, including:
• an optical radiation source that focuses at a focal point,
• a translation system to adjust a location of the focal point in three-dimensional space,
• one or more imaging devices configured to image a sealing element of a package after the package passes the optical radiation source,
• one or more environmental sensors, and
• a variable-speed cut conveyor to convey the package through the cutting device and past the optical radiation source;
• a height dimensioner to detect height data related to a vertical dimension of the package;
• and
• a computing system including a memory and one or more processors and being communicatively coupled to the cutting device, the computing system configured to execute instructions to:
• receive height data related to the vertical dimension of the package from the height dimensioner,
• retrieve historical cut quality for at least one previous package from the memory,
• receive environmental measurement data from the one or more environmental sensors,
• adjust a speed of the variable-speed cut conveyor based upon the height data, the historical cut quality, or the environmental measurement data,
• align the focal point of the optical radiation source to a sealing element of the package using the translation system,
• apply radiation from the optical radiation source to cut the sealing element,
• after the package passes the optical radiation source, determine a cut quality for the package based on image data from the one or more imaging devices, and
• store the cut quality for the package in the memory.