Polishing layer and polishing method
AssigneeIV Technologies CO., Ltd.
InventorsYu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
Life of this patent
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Abstract
A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
Claims7
A polishing layer having a surface pattern, wherein a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, and each of the grooves is disposed between every two adjacent polishing portions, wherein the polishing layer comprises:
- a body layer;
- and
- a surface layer disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
Dependencies are inferred from the claim text.