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US 2020/0047291 A1Published application
Flux and Solder Paste
AssigneeSenju Metal Industry Co., Ltd.
InventorsMasato Shiratori, Hiroyoshi Kawasaki, Yasuhiro Kajikawa
Life of this patent
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Abstract
A flux including: a) a phenolic activator except a hindered phenol, b) a resin, c) an organic acid, and d) a solvent. The phenolic activator, which is contained in the flux, has a molecular weight of 150 or more and 550 or less. Further, the flux may include: a) a phenolic activator except a hindered phenol and b) an acrylic resin.
Claims18
A flux comprising:
- a) a phenolic activator having a molecular weight of 150 or more and 550 or less except a hindered phenol or p-nonylphenol,
- b) a resin,
- c) an organic acid, and
- d) a solvent,
- wherein the phenolic activator is contained in an amount of 1 wt% or more and 30 wt% or less;
- the resin consists of a rosin and an acrylic resin, wherein the rosin is contained in an amount of 30 wt % or more and 60 wt % or less, the acrylic resin is contained in an amount of 0 wt % or more and 40 wt % or less, and the resin is contained in an amount of 30 wt % or more and 60 wt % or less;
- and
- the organic acid is contained in an amount of 0 wt % or more and 10 wt % or less.
5 more elements
A flux comprising:
- a) a phenolic activator except a hindered phenol, and
- b) resin consisting of rosin and an acrylic resin,
- wherein the phenolic activator is contained in an amount of 1 wt % or more and 30 wt % or less;
- the acrylic resin is contained in an amount of 0 wt% or more and 40 wt% or less;
- the resin is contained in an amount of 30 wt% or more and 60 wt% or less;
- the weight ratio of the acrylic resin to the resin consisting of the rosin and the acrylic resin is 20% or more and 80% or less;
- and
- the organic acid is contained in an amount of 0 wt % or more and 10 wt % or less.
5 more elements
Dependencies are inferred from the claim text.