Additive manufacturing processes and additively manufactured products
AssigneeThe Research Foundation for The State University of New York
InventorsScott N. Schiffres, Arad Azizi
Life of this patent
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Abstract
A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.
Claims21
A method for forming a structure, comprising:
- providing a substrate having a surface;
- depositing a first powder comprising components of a first melting temperature composition, having a composition that, when heated, chemically reacts with the substrate;
- heating the first powder, on the substrate, with a localized energy source to melt the first powder, and to react the melted first melting temperature composition with the surface, to form a first bonding interlayer;
- and
- cooling the melted first powder to form a fused first melting temperature layer having a lower boundary defined by the first bonding interlayer and an upper a surface formed of the first melting temperature composition.
A method for forming a structure bonded to a substrate, comprising:
- providing a substrate;
- forming an interlayer by chemical reaction on the substrate, between the substrate and a metal layer;
- depositing a metallic powder on the metal layer;
- heating a portion of the metallic powder deposited on the substrate with a localized energy source in a localized heating region, the localized energy source being dynamically controlled to regionally melt the portion of the metallic powder substantially while leaving an adjacent portion of the metallic powder unmelted, and without bringing the substrate underneath the localized heating region into thermal equilibrium;
- and
- cooling the regionally melted portion of the metallic powder to form a solid layer.
A method of forming a structure on an integrated circuit, comprising:
- depositing a powder on a surface of a substrate comprising an integrated circuit;
- and
- locally heating the powder to a sufficient temperature to melt the powder with focused energy, having limited duration at a particular region to avoid heat-induced functional damage to the integrated circuit, and cooling the melted powder to form a solid layer,
- wherein an adherent bonding layer is present between the substrate and the solid layer comprising a chemical reaction product distinct from a composition of the surface and a composition of the solid layer.
Dependencies are inferred from the claim text.