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AssigneeTokyo Electron Limited
InventorsShogo Fukui, Gentaro Goshi
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A method of removing particles of a substrate processing apparatus includes a pressure increasing process, a circulating process, and a particle removing process. In the pressure increasing process, a pressure in a processing space is increased by supplying a cleaned fluid from a first supply line to the processing space in a state where a second on-off valve and a third on-off valve are closed. In the circulating process, a processing fluid is supplied from a second supply line to the processing space and discharged from a discharge line by opening the second on-off valve and the third on-off valve after the pressure increasing process. In the particle removing process, a flow of the cleaned fluid is generated against the pressure of the processing space in the second supply line by opening and closing the second on-off valve during the pressure increasing process.
A method of removing particles of a substrate processing apparatus in which a drying process is performed by bringing a substrate in a state where a surface is wet with a liquid into contact with a processing fluid of a supercritical state to dry the substrate,
A substrate processing apparatus in which a drying process is performed by bringing a substrate in which a surface thereof is wet with a liquid into contact with a supercritical processing fluid to dry the substrate, the substrate processing apparatus comprising:
Dependencies are inferred from the claim text.