Endoscope, image pickup module and manufacturing method for image pickup module
AssigneeOlympus Corporation
InventorsTakatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
Life of this patent
Estimating the term…
Loading patent…
AssigneeOlympus Corporation
InventorsTakatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
Estimating the term…
An image pickup module includes a stacked device in which a plurality of elements are stacked, adjacent elements are electrically connected together by element joints and a rear surface electrode is arranged on a rear surface, a wiring board in which a first electrode electrically connected to the rear surface electrode by a relay joint and a second electrode electrically connected to the first electrode via a relay wiring pattern are arranged, and a signal cable electrically connected to the second electrode via a cable joint, and in the stacked device, of a first region and a second region obtained by dividing the rear surface into two portions, the element joints are arranged only in a first space in which the first region is extended in an optical axis direction and the rear surface electrode is arranged only in the second region.
An endoscope provided with an image pickup module, the image pickup module comprising:
An image pickup module comprising:
A manufacturing method for an image pickup module, the manufacturing method comprising:
Dependencies are inferred from the claim text.