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US 2020/0029468 A1Published application
Electronic chassis with heat exchanger
AssigneeGE Aviation Systems LLC
InventorsMichel Engelhardt, Ning Liu
Life of this patent
Estimating the term…
Abstract
Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path.
Claims20
An electronics chassis, comprising:
- an electronics housing defining a space for at least one electronic component;
- an air-to-air heat exchanger thermally coupled to at least a portion of the electronics housing and having a flow-through air path;
- and
- a plenum coupled to the electronics housing and defining a plenum chamber that is fluidly isolated from the space and fluidly coupled to the flow-through air path, the plenum having an air flow inlet and at least one entrainment slot, which are fluidly coupled to the plenum chamber.
1 more element
An electronics chassis, comprising:
- an electronics housing defining a space for at least one electronic component;
- an air-to-air heat exchanger thermally coupled to at least a portion of the electronics housing and having a flow-through air path;
- and
- a plenum coupled to the electronics housing and defining a plenum chamber that is fluidly isolated from the space and fluidly coupled to the flow-through air path, the plenum having an air flow inlet fluidly coupled to the plenum chamber, and at least one entrainment slot fluidly coupled to the plenum chamber.
1 more element
Dependencies are inferred from the claim text.