Heat sink and electronic device using same
AssigneeChiun Mai Communication Systems, Inc.
InventorYU-WEI CHANG
Life of this patent
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Abstract
A heat sink allowing a reduced thickness of an electronic device includes a housing, a wick structure, and a heat transfer fluid. The housing, comprising an upper housing and a lower housing, are opposite and form a sealed cavity. The wick structure and the heat transfer fluid are received in the cavity, the liquid absorbing heat and becoming gaseous upon reaching a certain temperature. The area of the upper housing is larger than the area of the lower housing. The upper housing forms a protrusion with respect to an edge of the lower housing. An electronic device using the heat sink is also provided.
Claims10
A heat sink, comprising:
- a housing, wherein the housing comprises an upper housing and a lower housing, the upper housing and the lower housing are oppositely positioned and sealed to form a cavity, an area of the upper housing is larger than an area of the lower housing, the upper housing forms a protrusion with respect to an edge of the lower housing;
- a wick structure in the cavity;
- a heat transfer fluid in the cavity.
An electronic device comprising:
- a heat sink comprising:
- a housing, wherein the housing comprises an upper housing and a lower housing, the upper housing and the lower housing are oppositely positioned and sealed to form a cavity, an area of the upper housing is larger than an area of the lower housing, the upper housing forms a protrusion with respect to an edge of the lower housing;
- a wick structure in the cavity;
- a heat transfer fluid in the cavity;
- a middle frame, wherein the middle frame comprises a groove, the heat sink is received in the groove.
Dependencies are inferred from the claim text.