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US 2020/0029452 A1Published application
Cooling arrangement
AssigneeMahle International GmbH
InventorsMatthias Ganz, Jessica Kansy, Thomas Kalmbach, Michael Trebbe
Life of this patent
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Abstract
A cooling arrangement may include a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system may be arranged. The dielectric fluid may be in heat-transferring contact with the power electronics system and may cool the power electronics system via a fluid movement. The fluid movement may be provided via acceleration forces acting on the cooling arrangement.
Claims20
A cooling arrangement, comprising:
- a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system are arranged;
- wherein the dielectric fluid is in heat-transferring contact with the power electronics system and cools the power electronics system via a fluid movement which is provided via acceleration forces acting on the cooling arrangement.
A motor vehicle, comprising:
- a cooling arrangement including:
- a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system are arranged;
- the dielectric fluid in heat-transferring contact with the power electronics system and cooling the power electronics system via a fluid movement which is provided via acceleration forces acting on the cooling arrangement;
- an internal combustion engine;
- a cooling fluid circuit in which a first heat exchanger, a second heat exchanger, and a cooling fluid pump are arranged, the first heat exchanger arranged in the housing, the second heat exchanger arranged externally to the housing;
- wherein the first heat exchanger is structured and arranged to cool the dielectric fluid and the second heat exchanger is structured and arranged to cool a cooling fluid which flow in the cooling fluid circuit;
- and
- wherein the second heat exchanger is a cooling fluid radiator of the internal combustion engine.
5 more elements
A cooling arrangement, comprising:
- a fluid-tight housing structured to retain a dielectric fluid;
- and
- a slosh cooled power electronics system arranged in the housing such that the power electronics system is in heat-transferring contact with the dielectric fluid and the dielectric fluid is flowable around the power electronics system when the dielectric fluid is sloshed about within the housing via acceleration forces acting on the cooling arrangement.
Dependencies are inferred from the claim text.