Housing and electronic device using the same
AssigneesShenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
InventorsYI XIONG, WEI DENG, KE-LONG WU, KUN-HUA CHEN
Life of this patent
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Abstract
A light emitting diode package includes a light emitting diode chip, a light conversion layer covering the light emitting diode chip, a reflecting layer surrounding the light emitting diode chip. The light emitting chip has a light output top surface, a first electrode and a second electrode. The first electrode and the second electrode are opposite to the light output top surface. The light emitting diode package further includes a supporting layer made of metal material. The supporting layer is mounted on a bottom surface of the reflecting layer facing away from the light output top surface and surrounds the light emitting chip and the light conversion layer.
Claims16
A housing comprising:
- a metal part comprising:
- at least one partition groove;
- wherein the at least one partition groove divides the metal part into at least two substrates, each end portion of each of the at least two substrates comprises at least one gripping structure;
- and
- at least one plastic part;
- wherein the at least one plastic part is connected to the at least two substrates of the metal part by each of the at least one plastic part being received in one of the at least one partition groove, and embedded into gripping structures.
An electronic device comprising:
- a housing comprising:
- a metal part comprising:
- at least one partition groove;
- wherein the at least one partition groove divides the metal part into at least two substrates, each end portion of each of the at least two substrates comprises at least one gripping structure;
- and
- at least one plastic part;
- wherein the at least one plastic part is connected to the at least two substrates of the metal part by each of the at least one plastic part being received in one of the at least one partition groove, and embedded into gripping structures.
Dependencies are inferred from the claim text.