Surface-treated copper foil, and copper-clad laminate and printed wiring board using same

A surface-treated copper foil comprising a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed, wherein

• observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that
• on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of a ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less, and an average value of the particle height of the roughening particles is 0.50 μm or more and 1.20 μm or less.

A surface-treated copper foil comprising a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed, wherein

• observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that
• on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of a ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less, and an average value of the particle height of the roughening particles is 0.50 μM or more and 1.20 μm or less, and a standard deviation of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 1.20 or more and 2.00 or less.