Preparation of Electrical Circuits by Adhesive Transfer

A method of preparing an electrical circuit on a surface comprising:

• providing a structured releasing substrate comprising a series of protrusions and depressions on the surface of the releasing substrate, and having a fluorinated release layer on the surface of the releasing substrate, wherein the fluorinated release layer comprises a release surface prepared by plasma deposition;
• preparing a layer of circuit-forming material on the release layer on the surface of the structured releasing substrate;
• removing the circuit-forming material from the protrusions of the releasing substrate;
• providing an adhesive or a pre-adhesive layer;
• contacting the adhesive layer or the pre-adhesive layer to the circuit-forming material in the depressions of the structured releasing substrate;
• if the adhesive layer is a pre-adhesive layer, curing the pre-adhesive layer to form an adhesive layer;
• and
• removing the adhesive layer from the surface of the structured releasing substrate, such that at least a portion of the circuit-forming material in the depressions of the structured releasing substrate at least partially adheres to the surface of the adhesive layer upon removal to form an adhesive surface with an electrical circuit on it.

A method of preparing an electrical circuit on a surface comprising:

• providing an unstructured releasing substrate having a fluorinated release layer on the surface of the releasing substrate wherein the fluorinated release layer comprises a release surface prepared by plasma deposition;
• preparing a layer of circuit-forming material on the release layer on the surface of the releasing substrate;
• providing an embossing tool comprising a surface with protrusions and depressions;
• embossing the embossing tool against the layer of circuit-forming material on the release layer on the surface of the releasing substrate with pressure to prepare an embossed surface in the layer of circuit-forming material on the release layer on the surface of the releasing substrate;
• removing the embossing tool from the layer of circuit-forming material on the release layer on the surface of the releasing substrate;
• providing an adhesive layer;
• contacting the adhesive layer to the circuit-forming material on the embossed protrusions of the embossed surface of the releasing substrate;
• and
• removing the adhesive layer from the embossed surface of the releasing substrate, such that at least a portion of the circuit-forming material on the embossed protrusions of the releasing substrate at least partially adheres to the surface of the adhesive layer upon removal to form an adhesive surface with an electrical circuit on it.

A method of preparing an electrical circuit on a surface comprising:

• providing an unstructured releasing substrate having a fluorinated release layer on the surface of the releasing substrate, wherein the fluorinated release layer comprises a release surface prepared by plasma deposition;
• preparing a layer of circuit-forming material on the release layer on the surface of the releasing substrate;
• providing an structured adhesive layer comprising a surface with protrusions and depressions;
• contacted the structured adhesive layer against the layer of circuit-forming material on the release layer on the surface of the releasing substrate such that only the protrusions of the structured adhesive layer contact the layer of circuit-forming material;
• removing the adhesive layer from the releasing substrate, such that at least a portion of the circuit-forming material on the protrusions of the structured adhesive layer at least partially adheres to the surface of the adhesive layer upon removal to form an adhesive surface with an electrical circuit on it.

A multilayer article comprising:

• an adhesive layer comprising a first major surface and a second major surface;
• an electrical circuit in contact with at least a portion of the first major surface of the adhesive layer;
• and
• a structured releasing substrate with a first major surface and a second major surface,
• wherein the second major surface comprises a structured surface comprising a series of protrusions and depressions on the surface of the releasing substrate, and having a fluorinated release layer on the surface of the releasing substrate;
• and wherein at least a portion of the second major surface of the releasing substrate is in contact with the electrical circuit.