Display apparatus and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsDong Yeob LEE, Byung Chul KIM, Seung Ryong HAN
Life of this patent
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Abstract
A display apparatus and a manufacturing method thereof are provided. The display apparatus includes a printed circuit board on which a plurality of light emitting diodes (LEDs) is mounted; a frame configured to support the printed circuit board, and including a frame hole passing through the frame; a chassis coupled to the frame, and including a chassis hole configured to correspond to the frame hole; and a bonding member positioned between the printed circuit board and the frame, through the frame hole and the chassis hole, the bonding member configured to bond the frame to the printed circuit board.
Claims20
A display apparatus comprising:
- a printed circuit board on which a plurality of light emitting diodes (LEDs) is mounted;
- a frame configured to support the printed circuit board, and including a frame hole passing through the frame;
- a chassis coupled to the frame, and including a chassis hole configured to correspond to the frame hole;
- and
- a bonding member positioned between the printed circuit board and the frame, through the frame hole and the chassis hole, the bonding member configured to bond the frame to the printed circuit board.
A display apparatus comprising:
- a plurality of printed circuit boards on which a plurality of light emitting diodes (LEDs) is mounted;
- a chassis configured to cover one surface of the plurality of printed circuit boards;
- a plurality of frames configured to support the plurality of printed circuit boards, respectively, and coupled to the chassis;
- and
- a bonding member configured to bond each of the plurality of printed circuit boards to a corresponding one of the plurality of frames after the plurality of frames is coupled to the chassis.
A manufacturing method of a display apparatus comprising:
- arranging a plurality of printed circuit boards on a jig so that the jig faces the plurality of printed circuit boards, the jig including a jig hole;
- fixing the plurality of printed circuit boards to the jig by suctioning air through the jig hole;
- providing a chassis assembly on the plurality of printed circuit boards so that the chassis assembly to faces the plurality of printed circuit boards;
- injecting a bonding member between the chassis assembly and the plurality of printed circuit boards;
- and
- bonding the chassis assembly to the plurality of printed circuit boards by curing the bonding member.
Dependencies are inferred from the claim text.