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US 2020/0029435 A1Published application
Printed circuit board including sub-circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYong-Ho BAEK, Jung-Hyun CHO, Seung-Yeop KOOK
Life of this patent
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Abstract
A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.
Claims20
A printed circuit board, comprising:
- a core member comprising a through-hole;
- a sub-circuit board disposed in the through-hole;
- a first insulating layer disposed on the core member and the sub-circuit board;
- and
- an outer circuit layer disposed on the first insulating layer, and comprising
- first circuit patterns having a first pitch and disposed to overlap the core member in a thickness direction, and
- second circuit patterns having a second pitch and disposed to overlap the sub-circuit board in the thickness direction,
- wherein the first pitch is larger than the second pitch.
5 more elements
(canceled)
(canceled)
A printed circuit board, comprising:
- a first circuit board comprising a first circuit;
- and
- a second circuit board embedded in the first circuit board between insulators, and comprising a second circuit electrically connected to the first circuit and having a circuit pattern density that is higher than a circuit pattern density of the first circuit,
- wherein the first circuit comprises first circuit patterns having a first pitch, and second circuit patterns having a second pitch and disposed between the first circuit patterns to overlap the second circuit board in a thickness direction, and
- wherein the first pitch is larger than the second pitch.
2 more elements
Dependencies are inferred from the claim text.