Wiring substrate and method of manufacturing the wiring substrate
AssigneeSeiko Epson Corporation
InventorsYutaka YAMAZAKI, Makoto KATO
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Abstract
A wiring substrate at which a metal wire is formed includes a substrate containing a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer constituting the metal wire. A formation portion of the metal wire at one surface of the substrate is rougher than a non-formation portion of the metal wire at the one surface of the substrate, and has the organic substance in a state of being embedded in the resin, and a catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.
Claims8
A wiring substrate at which a metal wire is formed, comprising:
- a substrate containing a resin as a main component and an organic substance having a hydroxyl group;
- and
- a metal plating layer constituting the metal wire, wherein
- a formation portion of the metal wire at one surface of the substrate
- is rougher than a non-formation portion of the metal wire at the one surface of the substrate, and
- has the organic substance in a state of being embedded in the resin, and a catalyst.
A wiring substrate at which a metal wire is formed, comprising:
- a substrate having a resin as a main component;
- and
- a metal plating layer constituting the metal wire, wherein
- the substrate has a metal particle obtained by coating an organic substance having a hydroxyl group with a metal, and
- the metal particle in a formation portion of the metal wire at one surface of the substrate is in a state of being embedded in the resin.
A method of manufacturing a wiring substrate, comprising:
- a substrate molding step of molding a substrate by using a material containing a resin as a main component and an organic substance having a hydroxyl group;
- a laser irradiation step of irradiating the substrate with a laser beam;
- a catalyst applying step of applying a catalyst to a laser irradiation region of the substrate;
- and
- a metal plating step of providing metal plating in the laser irradiation region of the substrate to which the catalyst was applied.
A method of manufacturing a wiring substrate, comprising:
- a precipitation step of precipitating a metal ion in an aqueous solution containing the metal ion, an organic substance, and a catalyst to obtain a metal particle;
- a kneading step of kneading the metal particle and the resin;
- a substrate molding step of molding a substrate by using a material kneaded in the kneading step;
- a laser irradiation step of irradiating the substrate with a laser beam;
- and
- a metal plating step of providing metal plating in a laser irradiation region of the substrate.
Dependencies are inferred from the claim text.