Module and method of manufacturing module

A method of manufacturing a module comprising:

• preparing a circuit board that includes a substrate having a first face and a second face, a first metal pattern provided over the first face side, a first electrode provided in a periphery of the first metal pattern over the first face side, a second electrode provided over the second face side, and a second metal pattern thermally connected to the first metal pattern and in which an electronic device is fixed on the first metal pattern and an electronic component is electrically connected to the second electrode;
• and
• connecting the first electrode and a third electrode of the electronic device to each other by a bonding wire with the electronic device being heated,
• wherein in the connecting, by using a board support stage, the electronic device is heated by transferring heat supplied to the second metal pattern to the electronic device via the first metal pattern with the circuit board being supported so as to form a space including the electronic component between the second face and the board support stage.