Antenna module
AssigneeSamsung Electronics Co., Ltd.
InventorsWon Wook So, Jin Seon Park, Young Sik Hur, Jung Chul Gong, Yong Ho Baek
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Abstract
An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.
Claims20
An antenna module comprising:
- an antenna substrate including an antenna pattern;
- a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein;
- and
- an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance,
- wherein the electronic component has a thickness greater than that of the semiconductor chip.
An antenna module comprising:
- an antenna substrate including an antenna pattern;
- a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein;
- and
- a connection substrate, on which an electronic component is disposed, connected to the antenna substrate,
- wherein the electronic component has a thickness greater than that of the semiconductor chip, and is spaced apart from the antenna substrate and electrically connected to the antenna substrate through the connection substrate.
Dependencies are inferred from the claim text.