Connection structure of dielectric waveguide
AssigneeMitsubishi Electric Corporation
InventorsHideharu YOSHIOKA, Yasuo MORIMOTO, Naofumi YONEDA, Akimichi HIROTA, Tomokazu HAMADA, Tsuyoshi HATATE
Life of this patent
Estimating the term…
Abstract
Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.
Claims8
A connection structure for dielectric waveguides, comprising:
- a first multi-layer dielectric substrate, which includes a first dielectric waveguide having a first opening portion, and is configured to propagate a high-frequency signal therethrough;
- and
- a second multi-layer dielectric substrate, which includes a second dielectric waveguide having a second opening portion, is arranged to be opposed to the first multi-layer dielectric substrate so that the first opening portion and the second opening portion are opposed to each other through a first space therebetween, and is configured to propagate the high-frequency signal therethrough,
- wherein the first multi-layer dielectric substrate includes:
- a first surface-layer conductor, which is provided so as to cover a surface of the first multi-layer dielectric substrate, the surface being opposed to the second multi-layer dielectric substrate, has the first opening portion formed therethrough, and has first cutouts formed at two positions spaced by λ/4 away from edges of the first opening portion so as to be opposed to each other through the first opening portion therebetween;
- a first inner-layer conductor, which is provided in the first multi-layer dielectric substrate so as to be opposed to the first surface-layer conductor, and has a first conductor removed portion formed at a position opposed to the first opening portion;
- and
- a plurality of first conductor columns, which are provided to extend from the first surface-layer conductor through the first inner-layer conductor in a laminating direction of the first multi-layer dielectric substrate so as to surround the first opening portion, and are arranged so as to form a waveguide wall of the first dielectric waveguide,
- wherein the first multi-layer dielectric substrate has choke structures at two positions opposed to each other through the first opening portion therebetween,
- wherein the choke structures include first choke passages, each having a length of λ/4, and second choke passages, each having a length of λe/4,
- wherein each of the first choke passages is formed as a space from each of the edges of the first opening portion to a corresponding one of the first cutouts in the first space,
- wherein each of the second choke passages is formed as a space surrounded by a plurality of third conductor columns provided along an edge of each of the first cutouts, which is on a side opposite to a side on which the first dielectric waveguide is located, so as to connect the first surface-layer conductor and the first inner-layer conductor and the first conductor columns in a second space between the first surface-layer conductor and the first inner-layer conductor,
- wherein a part of the first conductor columns is arranged at a position spaced by λe/4 away from each of the first cutouts toward the first opening portion, in which λ is a free-space wavelength of a signal wave, and λe is an effective wavelength in the dielectric substrates.
Dependencies are inferred from the claim text.