Quantum dot light-emitting diode substrate having a bonding layer, and method of preparing the same
AssigneeBoe Technology Group Co., Ltd.
InventorsYanzhao LI, Chungchun LEE, Zhuo CHEN, Yuanming ZHANG
Life of this patent
Estimating the term…
Abstract
A quantum dot light-emitting diode substrate having a bonding layer and a method of preparing the same are provided. The quantum dot light-emitting diode substrate including a plurality of sub-pixel light-emitting regions, wherein each of the sub-pixel light-emitting regions includes a light-emitting layer including a bonding layer and a quantum dot bonded to the bonding layer. The quantum dot light-emitting diode substrate can be prepared with high resolution by a convenient process, and is suitable for mass production.
Claims20
A method of preparing a quantum dot light-emitting diode substrate, comprising:
- Step 1:
- forming a layer of a bonding material on a substrate and patterning the layer of the bonding material to form a bonding layer corresponding to a pattern of a plurality of sub-pixel light-emitting regions;
- Step 2:
- applying a quantum dot onto the bonding layer;
- Step 3:
- allowing the quantum dot to be bonded to the bonding layer by an external initiation condition so as to fix the quantum dot in a corresponding sub-pixel light-emitting region;
- and
- Step 4:
- removing unbonded quantum dots to form a light-emitting layer comprising the bonding layer and quantum dots bonded to the bonding layer.
Dependencies are inferred from the claim text.