Light emitting diode array package structure with high thermal conductivity

A light emitting diode array package structure with high thermal conductivity suitable for being mounted on a heat sink, comprising:

• a package substrate disposed on the heat sink and including a circuit layer and an insulating layer, the insulating layer being located on the circuit layer;
• a light emitting diode array including a plurality of light emitting diode chips arranged in an array form, wherein each of the light emitting diode chips is directly mounted on the insulating layer of the package substrate and electrically connected to the circuit layer;
• a high thermal conductive color conversion layer directly dispensed on the light emitting diode array and the package substrate, the high thermal conductive color conversion layer including a transparent optical resin, a phosphor powder and a transparent ceramic filler, wherein the phosphor powder and the transparent ceramic filler are mixed into the transparent optical resin, and a portion of the transparent ceramic filler is in direct contact with the package substrate to form a thermal conduction path;
• and
• a transparent ceramic substrate directly covering and being in contact with an upper surface of the high thermal conductive color conversion layer, and being in contact with another portion of the transparent ceramic filler to form another thermal conduction path.