Method for Producing an Optoelectronic Component, and Optoelectronic Component

A method for producing an optoelectronic component, the method comprising:

• providing a semiconductor chip having an active region for radiation emission;
• applying a seed layer on the semiconductor chip, wherein the seed layer comprises a first metal and a second metal being different from the first metal, and wherein the second metal is less noble than the first metal;
• applying a structured photoresist layer directly to the seed layer;
• and
• applying a solder layer at least to regions of the seed layer which are not covered by the photoresist layer,
• wherein a ratio of the first metal to the second metal in the seed layer is between 95:5 to 99:1.

An optoelectronic component comprising:

• a semiconductor chip comprising an active region configured to emit radiation;
• a structured seed layer comprising a first metal and a second metal being different from the first metal, wherein the second metal is less noble than the first metal, and wherein the seed layer is arranged on the semiconductor chip;
• and
• a solder layer arranged directly on the seed layer,
• wherein a ratio of the first metal to the second metal in the seed layer is between 95:5 to 99:1.