US 2020/0028037 A1Published application

Multiple encapsulated led arrays on a single printed circuit board (pcb)

AssigneeAppleton Grp LLC

InventorsSumit Kumar, Milind Nimgulkar, Ajay Tripathi

Life of this patent

Estimating the term…

Loading patent…

Abstract

Multiple encapsulated LED arrays on a single printed circuit board of an LED engine, the LED engine including a plurality of LED arrays that are mounted on the printed circuit board in a spaced apart configuration, and are electrically isolated from each other, and a plurality of encapsulation layers, wherein each of the encapsulation layers is configured to encapsulate each of the LED arrays, and is further configured to protect the area proximal to the LED engine from arc or spark generated by the LED engine, wherein each of the encapsulation layers includes a plurality of blisters that are configured to encapsulate at least one LED of an LED array, and is further configured to transform the light emitted by the LEDs into a desired light beam pattern, and at least one planar portion configured to encapsulate electrical traces formed on the printed circuit board.

Claims10

Dependent claims

Multiple encapsulated LED arrays on a single printed circuit board (104) of an LED engine (100), said LED engine (104) comprising:

a plurality of LED arrays (114), wherein each of said LED arrays (114) are mounted on said printed circuit board (104) in a spaced apart configuration, and are electrically isolated from each other;
and
a plurality of encapsulation layers (102), wherein each of said encapsulation layers (102) is configured to encapsulate each of said LED arrays (114), and is further configured to protect the area proximal to said LED engine (100) from arc or spark generated by said LED engine (100), wherein
each of said encapsulation layers (102) including:
a plurality of blisters (106), wherein each of said blisters (106) is configured to encapsulate at least one LED (114a) of an LED array (114), and is further configured to transform the light emitted by said LEDs (114a) into a desired light beam pattern;
and
at least one planar portion (108) configured to encapsulate electrical traces (114b) formed on said printed circuit board (104).

4 more elements

Dependencies are inferred from the claim text.