Optoelectronic Semiconductor Chip and Method of Manufacturing the Same

An optoelectronic semiconductor chip comprising:

• a plurality of fins;
• and
• a current expansion layer for common contacting of at least some of the fins, each fin comprising:
• two side surfaces arranged opposite one another;
• and
• an active region arranged on each of the side surfaces,
• wherein the plurality of fins comprises inner fins and outer fins having an adjacent fin only on one side, and
• wherein the current expansion layer is in direct contact with the inner fins on their outside.

A method of manufacturing an optoelectronic semiconductor chip, the method comprising:

• providing a substrate;
• forming a mask layer on the substrate, wherein the mask layer has openings and wherein at least some of the openings extend parallel to each other;
• and
• forming a fin at at least some of the openings,
• wherein the mask layer is pre-structured with respect to a chip layout and has no openings in an edge region of the optoelectronic semiconductor chip,
• wherein the fin is produced by a metal-organic vapor phase epitaxy,
• wherein the fin has two side surfaces which are arranged opposite one another, and
• wherein an active region is arranged on each of the side surfaces.