Highly reflective gain type photovoltaic packaging adhesive film and usage

A high reflection gain type photovoltaic encapsulating film, comprising:

• an encapsulating layer;
• and
• a reflecting layer,
• wherein the encapsulating layer has a thickness of 200 μm to 500 μm and is prepared by mixing 60 wt % to 90 wt % of a first matrix resin, 0.5 wt % to 30 wt % of a modified additive, 0.1 wt % to 10 wt % of an ultraviolet stabilizer, 0.1 wt % to 3 wt % of an anti-thermo-oxidative aging agent and 0.1 wt % to 3 wt % of an initiator, then melting at a temperature of 60° C. to 200° C. and casting into a film;
• the first matrix resin is prepared by copolymerizing ethylene and one or two monomers selected from propylene, butene, heptene, octene, norbornene, vinyl acetate, methyl acrylate, and methyl methacrylate;
• the reflecting layer has a thickness of 5 to 200 μm, and is prepared by mixing 60 wt % to 85 wt % of a second matrix resin, 3 wt % to 30 wt % of an auxiliary resin, 3 wt % to 30 wt % of a first filler, 0 wt % to 20 wt % of a second filler, 0.5 wt % to 10 wt % of a modified additive, 0.5 wt % to 20 wt % of a diluent, 0 wt % to 1 wt % of an ultraviolet stabilizer, 0.001 wt % to 5 wt % of an anti-thermo-oxidative aging agent and 0.001 wt % to 5 wt % of an initiator, then coating the mixture on a surface of the encapsulating layer and then curing at a temperature of 30° C. to 150° C.