Schottky diode with high breakdown voltage and surge current capability using double p-type epitaxial layers
AssigneeAZ Power, Inc
InventorsNA REN, ZHENG ZUO, RUIGANG LI
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AssigneeAZ Power, Inc
InventorsNA REN, ZHENG ZUO, RUIGANG LI
Estimating the term…
A method for manufacturing a Silicon Carbide (SiC) Schottky diode may include steps of providing a substrate; forming a first epitaxial layer with a first conductivity type on top of the substrate; forming a second epitaxial layer with a second conductivity type on top of the first epitaxial layer; forming a third epitaxial layer with the second conductivity type on top of the second epitaxial layer; patterning and etching the second and third epitaxial layers to form a plurality of trenches; depositing a first ohmic contact metal on a backside of the substrate; forming a second ohmic contact metal on top of the second epitaxial layer; forming a Schottky contact metal at a bottom portion of each trench; and forming a pad electrode on top of the Schottky contact metal.
A method for manufacturing a Silicon Carbide (SiC) Schottky diode comprising steps of:
A Silicon Carbide (SiC) Schottky diode comprising:
Dependencies are inferred from the claim text.