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US 2020/0027867 A1Published application
Dynamic random access memory (dram) mounts
AssigneeIntel Corporation
InventorsEng Huat Goh, Hoay Tien Teoh
Life of this patent
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Abstract
Donut-shaped Dynamic Random Access Memory (DRAM) includes a hole that fits around a processor, such that the DRAM and the processor are adjacent to one another on an Integrated Circuit (IC) package. In an embodiment, a heat spreader is mounted on top of the processor and covers a top of the DRAM without touching the DRAM.
Claims21
(canceled).
A circuit package, comprising:
- a first memory device situated to a first side of a processor in parallel to the processor and mounted on a package board of a processor assembly;
- and
- a second memory device situated to a second side of the processor in parallel to the processor and mounted on the package board of the processor assembly.
A method, comprising:
- mounting a first donut-shaped Dynamic Random-Access Memory (DRAM) on a packaging board of a processor assembly on a first side of the packaging board;
- mounting a second donut-shaped DRAM on the packaging board of the processor assembly on a second side of the packaging board;
- and
- mounting a processor in parallel with the first donut-shaped DRAM and the second donut-shaped DRAM on the packaging board and between the first donut-shaped DRAM and the second donut-shaped DRAM.
1 more element
An apparatus, comprising:
- a first donut-shaped Dynamic Random-Access Memory (DRAM) situated on a first side of a packaging board associated with a processor assembly;
- a second donut-shaped DRAM situated on a second side of the packaging board;
- and
- a processor mounted between the first donut-shaped DRAM and the second donut-shaped DRAM and in parallel to the first donut-shaped DRAM and the second donut-shaped DRAM on the packaging board.
1 more element
Dependencies are inferred from the claim text.