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US 2020/0027859 A1Published application
Package structure and fabrication method thereof
AssigneeTongfu Microelectronics Co., Ltd.
InventorLei SHI
Life of this patent
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Abstract
The present disclosure provides a package structure and its packaging method. The packaging method includes: providing a bonding layer on a substrate; forming an improvement layer on the bonding layer, where the improvement layer has openings, and bottoms of the openings expose a surface of the bonding layer; providing chips, each including a non-functional surface; and mounting the chips by attaching the non-functional surface to the bonding layer at the bottoms of the openings.
Claims11
A fabrication method of a package structure, comprising:
- providing a bonding layer on a substrate;
- forming an improvement layer on the bonding layer, wherein the improvement layer has openings, and bottoms of the openings expose a surface of the bonding layer;
- providing chips, each including a non-functional surface;
- and
- mounting the chips by attaching the non-functional surfaces to the bonding layer at the bottoms of the openings.
2 more elements
A package structure, comprising:
- a bonding layer on a substrate;
- an improvement layer on the bonding layer, wherein the improvement layer has openings, and bottoms of the openings expose a surface of the bonding layer;
- and
- chips in the openings, wherein chips include non-functional surfaces attached to the bonding layer at the bottoms of the openings.
1 more element
Dependencies are inferred from the claim text.