Packaging structure and forming method thereof
AssigneeTongfu Microelectronics Co., Ltd.
InventorLei SHI
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Abstract
Packaging structure and method for forming a packaging structure are provided. A bonding layer is formed on the substrate. An improvement layer is formed on the bonding layer. The improvement layer contains openings exposing surface portions of the bonding layer at bottoms of the openings. Chips are provided and include functional surfaces. The chips are mounted on the substrate by bonding the functional surfaces of the chips to the bonding layer through the openings. Top surfaces of the chips are lower than or flush with a top surface of the improvement layer.
Claims20
A method of forming a packaging structure, comprising:
- providing a substrate;
- forming a bonding layer on the substrate;
- forming an improvement layer on the bonding layer, wherein the improvement layer contains openings exposing surface portions of the bonding layer at bottoms of the openings;
- providing chips, wherein the chips include functional surfaces;
- and
- mounting the chips on the substrate by bonding the functional surfaces of the chips to the bonding layer through the openings, wherein top surfaces of the chips are lower than or flush with a top surface of the improvement layer.
A packaging structure, comprising:
- a substrate;
- a bonding layer on the substrate;
- an improvement layer on the bonding layer, wherein the improvement layer contains openings exposing surface portions of the bonding layer at bottoms of the openings;
- and
- chips located in the openings, wherein the chips include functional surfaces that bond to the bonding layer, and top surfaces of the chips are lower than or flush with a top surface of the improvement layer.
Dependencies are inferred from the claim text.