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US 2020/0027857 A1Published application
Packaging structure and forming method thereof
AssigneeTongfu Microelectronics Co., Ltd.
InventorLei SHI
Life of this patent
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Abstract
Packaging structure and method of forming a packaging structure are provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.
Claims20
A method of forming a packaging structure, comprising:
- providing a substrate;
- forming an adhesive layer on the substrate;
- forming an improvement layer on the adhesive layer, wherein the improvement layer contains openings there-in, exposing surface portions of the adhesive layer at bottoms of the openings;
- providing a plurality of chips, wherein the plurality of chips includes functional surfaces;
- and
- mounting the plurality of chips on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.
3 more elements
A packaging structure, comprising:
- a substrate;
- an adhesive layer formed on the substrate;
- an improvement layer formed on the adhesive layer, wherein the improvement layer has openings exposing surface portions of the adhesive layer at bottoms of the openings;
- and
- chips located in the openings, wherein the chips include functional surfaces that adhere to the adhesive layer.
2 more elements
Dependencies are inferred from the claim text.