Fiducial for an electronic device

An electronic device, comprising:

• a substrate including one or more layers, the one or more layers including a dielectric material and one or more electrical traces;
• a cavity defined in the substrate, wherein the cavity is adapted to receive a semiconductor die;
• a layer of conductive material, wherein the layer of conductive material defines a void in the conductive material;
• a fiducial mark including a filler material positioned in the void defined by the conductive material and coupled to the layer of conductive material, wherein the fiducial mark is positioned proximate the cavity defined in the substrate;
• and
• wherein the filler material has a lower reflectivity in comparison to the conductive material to provide a contrast with the conductive material.

A method for manufacturing an electronic device, comprising:

• coupling a fiducial mark to a substrate, wherein coupling the fiducial mark to the substrate includes:
• coupling a layer of conductive material to the substrate, wherein the layer of conductive material defines a void in the layer of conductive material;
• and
• coupling a filler material to the layer of conductive material, wherein the filler material is positioned in the void defined in the layer of conductive material.