Interconnection structure and sensor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsun-Wei CHAN, Shih-Chieh TANG
Life of this patent
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Abstract
A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.
Claims21
A sensor package, comprising:
- a carrier;
- a sensor disposed on the carrier;
- an interconnection structure disposed on the carrier and surrounding the sensor, the interconnection structure having a first surface facing away from the carrier;
- a conductor disposed on the first carrier, the conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure;
- and
- a housing disposed on the carrier and surrounding the interconnection structure.
A sensor package, comprising:
- a first carrier;
- an interconnection structure disposed on the first carrier, the interconnection structure having a first surface facing away from the first carrier;
- a conductor disposed on the first carrier, the conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure;
- a sensor disposed on the interconnection structure and electrically connected to the conductor;
- and
- a housing disposed on the first carrier and surrounding the interconnection structure and the sensor.
Dependencies are inferred from the claim text.