Formation of semiconductor devices including electrically programmable fuses
AssigneeInternational Business Machines Corporation
InventorsJuntao Li, Chih-Chao Yang
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Abstract
A method for fabricating a semiconductor device including an electrically programmable fuse includes patterning dielectric material formed on a first electrode including a first conductive material to create one or more openings, and forming second conductive material within the one or more openings. Forming the second conductive material includes forming one or more voids encapsulated by the second conductive material such that the one or more voids have boundaries defined in part by portions of the second conductive material disposed between the one or more voids and the dielectric material. The portions of the second conductive material correspond to fuse links.
Claims20
A method for fabricating a semiconductor device including an electrically programmable fuse, comprising:
- patterning dielectric material formed on a first electrode including a first conductive material to create one or more openings;
- and
- forming second conductive material within the one or more openings, including forming one or more voids encapsulated by the second conductive material such that the one or more voids have boundaries defined in part by portions of the second conductive material disposed between the one or more voids and the dielectric material, the portions of the second conductive material corresponding to fuse links.
A method for fabricating a semiconductor device including an electrically programmable fuse having a thin link, comprising:
- forming a first electrode including a first conductive material on a substrate;
- forming dielectric material on the first electrode;
- patterning the dielectric material to create one or more openings;
- and
- fowling second conductive material within the one or more openings, including forming one or more voids encapsulated by the second conductive material such that the one or more voids have boundaries defined in part by portions of the second conductive material disposed between the one or more voids and the dielectric material, the portions of the second conductive material corresponding to fuse links,
A semiconductor device including an electrically programmable fuse, comprising:
- a substrate;
- a first electrode including a first conductive material on the substrate;
- dielectric material on the first electrode;
- one or more second electrodes including a second conductive material disposed on the first electrode between portions of the dielectric material;
- and
- one or more voids encapsulated by the second conductive material such that the one or more voids have boundaries defined in part by portions of the second conductive material disposed between the one or more voids and the dielectric material, the portions of the second conductive material corresponding to fuse links.
Dependencies are inferred from the claim text.