Advanced interconnects containing an imt liner
AssigneeInternational Business Machines Corporation
InventorsJoseph F. Maniscalco, Andrew Tae Kim, Baozhen Li, Chih-Chao Yang
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AssigneeInternational Business Machines Corporation
InventorsJoseph F. Maniscalco, Andrew Tae Kim, Baozhen Li, Chih-Chao Yang
Estimating the term…
An interconnect structure is provided that includes a liner located between an electrically conductive structure and an interconnect dielectric material layer. The liner is composed of a phase change material that is insulating at a first temperature, and becomes conductive at a second temperature that is higher than the first temperature. The liner that is composed of such a phase change material is referred to as an “insulator-to/from metal transition (IMT)” liner. In the present application, an entirety of, or a portion of, the IMT liner may be changed from an insulating phase to a conductive phase by increasing the temperature (i.e., heating) of the liner so as to provide a redundancy path in which electrons can flow.
A method of forming an interconnect structure, the method comprising:
Dependencies are inferred from the claim text.