Wiring substrate and electronic module
AssigneeMurata Manufacturing Co., Ltd.
InventorsRyota ASAI, Issei YAMAMOTO
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Abstract
A wiring substrate that is provided enables stray capacitance between a first electrode and a second electrode to be prevented from varying when an undulation occurs in the wiring substrate. Insulating layers are stacked. A first electrode and a second electrode are formed between the same layers at an interval. The thickness of the first electrode is more than the thickness of the second electrode. The lower main surface of the first electrode is located at a position lower than the lower main surface of the second electrode, and the upper main surface of the first electrode is located at a position higher than the upper main surface of the second electrode when seen through in a direction perpendicular to a stacking direction of the insulating layers.
Claims20
A wiring substrate comprising:
- insulating layers that are stacked;
- and
- a first electrode and a second electrode are provided between two layers of the insulating layers, the first electrode being spaced apart from the second electrode,
- wherein a thickness of the first electrode is larger than a thickness of the second electrode, and
- wherein a lower main surface of the first electrode is located at a position lower than a lower main surface of the second electrode, and an upper main surface of the first electrode is located at a position higher than an upper main surface of the second electrode in a stacking direction of the insulating layers when seen through in a direction perpendicular to the stacking direction of the insulating layers.
Dependencies are inferred from the claim text.