Modular Microjet Cooling Of Packaged Electronic Components
AssigneeMassachusetts Institute of Technology
InventorsJames Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
Life of this patent
Estimating the term…
Abstract
The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
Claims18
A modular microjet cooler, comprising:
- a base having a plurality of microjet nozzles and an exit port passing therethough, wherein the base comprises an outer surface that remains exposed after connection to a packaged heat generating device;
- raised sidewalls extending from the base away from the outer surface, defining a cavity having an open side opposite the base;
- an attachment mechanism disposed on ends of the raised sidewalls;
- an inlet tube attached to the outer surface of the base and in communication with the plurality of microjet nozzles;
- and
- an outlet tube attached to the outer surface of the base and in communication with the exit port.
(canceled)
A modular microjet cooler, comprising:
- a base having a plurality of microjet nozzles and an exit port passing therethough, wherein the base comprises a bottom surface that remains exposed after connection to a packaged heat generating device;
- raised sidewalls extending from the base away from the bottom surface, defining a cavity having an open side opposite the base;
- an attachment mechanism disposed on ends of the raised sidewalls;
- an inlet connector disposed on the bottom surface of the base opposite the cavity, the inlet connector having a passage in communication with the plurality of microjet nozzles;
- and
- an output connector disposed on the bottom surface of the base opposite the cavity, the output connector having a passage in communication with the exit port.
An assembly, comprising:
- a modular microjet cooler, comprising:
- a base having a plurality of microjet nozzles and an exit port passing therethough, wherein the base comprises an exterior bottom surface that remains exposed after connection to a packaged heat generating device;
- raised sidewalls extending from the base away from the exterior bottom surface, defining a cavity having an open side;
- and
- an attachment mechanism disposed on ends of the raised sidewalls;
- a seal disposed on the exterior bottom surface of the base, where the seal surrounds at least one of the plurality of microjet nozzles;
- a second seal disposed on the exterior bottom surface of the base, where the second seal surrounds the exit port;
- and
- a manifold having a first opening in communication with the microjet nozzles for providing supply fluid to the microjet nozzles, and a second opening for accepting exhaust fluid from the exit port.
Dependencies are inferred from the claim text.