Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsHyunki Kim, Sangsoo Kim, Seung Hwan Kim, Kyung Suk Oh, Yongkwan Lee, Jongho Lee
Life of this patent
Estimating the term…
Abstract
Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.
Claims20
A semiconductor package, comprising:
- a package substrate;
- a first semiconductor chip on the package substrate and including a first region and a second region;
- a second semiconductor chip in the first region;
- a heat radiation spacer in the second region;
- a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer;
- and
- a molding layer covering the first to third semiconductor chips and the heat radiation spacer.
A semiconductor package, comprising;
- a package substrate;
- a first semiconductor chip on the package substrate and including a first region and a second region;
- a heat radiation spacer on the first semiconductor chip, the heat radiation spacer comprising
- a base including a first segment in the first region and a second segment in the second region, and
- a protrusion on the second segment;
- a second semiconductor chip on the first segment;
- a third semiconductor chip supported by the second semiconductor chip and the protrusion;
- and
- a molding layer covering the first to third semiconductor chips and the heat radiation spacer.
A semiconductor package, comprising:
- a package substrate;
- a first semiconductor chip on the package substrate and including a first region and a second region;
- a pair of second semiconductor chips spaced apart from each other in the first region;
- a heat radiation spacer in the second region;
- a pair of third semiconductor chips on the pair of second semiconductor chips;
- and
- a molding layer covering the first to third semiconductor chips and the heat radiation spacer,
- wherein each of the third semiconductor chips includes:
- a first segment on a corresponding one of the second semiconductor chips;
- and
- a second segment on the heat radiation spacer.
Dependencies are inferred from the claim text.