Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

A method of forming an integrated circuit assembly, comprising:

• forming a substrate;
• forming a first integrated circuit device having a first surface and an opposing second surface;
• electrically attaching the first surface of the first integrated circuit device to the substrate;
• forming a second integrated circuit device having a first surface and an opposing second surface;
• electrically attaching the first surface of the second integrated circuit device to the second surface of the first integrated circuit device;
• and
• forming a heat dissipation device comprising:
• forming at least one first thermally conductive structure in contact with at least one of the first integrated circuit device, the second integrated circuit device, and the substrate;
• and
• forming a second thermally conductive structure over the at least one first thermally conductive structure, wherein the at least one first thermally conductive structure has a lower electrical conductivity than an electrical conductivity of the second thermally conductive structure.

An electronic system, comprising:

• a housing;
• a substrate in the housing;
• a first integrated circuit device having a first surface and an opposing second surface, wherein the first surface of the first integrated circuit device is electrically attached to the substrate;
• a second integrated circuit device having a first surface and an opposing second surface, wherein the first surface of the second integrated circuit device is electrically attached to the second surface of the first integrated circuit device;
• and
• a heat dissipation device comprising:
• at least one first thermally conductive structure in thermal contact with at least one of the first integrated circuit device, the second integrated circuit device, and the substrate;
• and
• a second thermally conductive structure disposed over the at least one first thermally conductive structure, wherein the at least one first thermally conductive structure has a lower electrical conductivity than an electrical conductivity of the second thermally conductive structure.