Semiconductor substrate, semiconductor package, and method for forming the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsCheng-Lin HO, Chih-Cheng LEE
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Abstract
The present disclosure provides a semiconductor substrate, including a first patterned conductive layer, a dielectric structure on the first patterned conductive layer, wherein the dielectric structure having a side surface, a second patterned conductive layer on the dielectric structure and extending on the side surface, and a third patterned conductive layer on the second patterned conductive layer and extending on the side surface. The present disclosure provides a semiconductor package including the semiconductor substrate. A method for manufacturing the semiconductor substrate and the semiconductor package is also provided.
Claims20
A semiconductor substrate, comprising:
- a first patterned conductive layer;
- a dielectric structure on the first patterned conductive layer, the dielectric structure having a side surface, wherein the side surface is an outermost surface and at a periphery of the dielectric structure;
- a second patterned conductive layer on the dielectric structure and extending on the side surface;
- and
- a third patterned conductive layer on the second patterned conductive layer and extending on the side surface.
A semiconductor package, comprising:
- a dielectric structure having a bottom surface configured to be proximal to a solder bump and a side surface connecting to the bottom surface, wherein the side surface is an outermost surface and at a periphery of the dielectric structure;
- a first patterned conductive layer proximal to a top surface of the dielectric structure, the top surface being opposite to the bottom surface;
- a second patterned conductive layer extending on the side surface;
- a third patterned conductive layer closer to the bottom surface than the first patterned conductive layer and extending on the side surface;
- and
- a semiconductor die over the top surface.
A method for manufacturing a semiconductor package, comprising:
- providing a carrier;
- forming a first patterned conductive layer on the carrier;
- forming a dielectric structure on the first patterned conductive layer;
- defining a scribe line region in the dielectric structure by forming an opening in the dielectric structure, wherein the first patterned conductive layer is exposed by the opening;
- and
- concurrently forming a second patterned conductive layer on the dielectric structure and into the opening.
Dependencies are inferred from the claim text.