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US 2020/0027809 A1Published application
3DIC Packaging with Hot Spot Thermal Management Features
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
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Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
Claims20
A package comprising:
- a first die stack bonded and electrically connected to a conductive line of a substrate;
- a second die stack bonded to the substrate and adjacent the first die stack;
- a thermal interface material on a surface of the conductive line;
- and
- a conductive lid thermally connected to the substrate through the thermal interface material, wherein a first portion of the conductive lid is thicker than a second portion of the conductive lid, the first portion of the conductive lid is directly over the first die stack, the second portion of the conductive lid is directly over the second die stack, and wherein a third portion of the conductive lid extends between a sidewall of the first die stack and a sidewall of the second die stack.
2 more elements
A package comprising:
- a first die stack;
- a package substrate, wherein the first die stack is electrically and physically connected to a conductive line of the package substrate;
- a first thermal interface material (TIM) extending through a solder resist to the conductive line, and wherein the conductive line extends continuously from the first die stack to the first TIM;
- and
- a first heat dissipation feature thermally connected to the first die stack through the first TIM.
2 more elements
A package comprising:
- a die stack comprising:
- a plurality of first dies;
- and
- a second die bonded to the plurality of first dies;
- a package substrate, wherein the die stack is bonded to a top surface of the package substrate, and wherein the package substrate comprises a conductive line electrically connected to the die stack;
- and
- a thermal interface material (TIM) contacting a portion of the conductive line exposed at the top surface of the package substrate, wherein the TIM surrounds the die stack in a top down view.
4 more elements
Dependencies are inferred from the claim text.