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US 2020/0027805 A1Published application
Semiconductor chip, method for mounting semiconductor chip, and module in which semiconductor chip is packaged
AssigneeMurata Manufacturing Co., Ltd.
InventorsIsao OBU, Yasunari UMEMOTO, Masahiro SHIBATA
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Abstract
A semiconductor chip includes a single-crystal substrate and a metal electrode on the bottom surface of the substrate. The metal electrode has a region in which a first metal is exposed and a region in which a second metal is exposed, the second metal having a standard electrode potential different from that of the first metal.
Claims12
A module comprising:
- a module substrate with a die pad on a surface of the module substrate;
- a semiconductor chip with a metal electrode on a bottom surface of the semiconductor chip, the metal electrode having a region in which a first metal is exposed and a region in which a second metal is exposed, the second metal having a standard electrode potential different from a standard electrode potential of the first metal;
- and
- an electroconductive adhesive layer bonding the metal electrode on the semiconductor chip to the die pad on the module substrate.
1 more element
Dependencies are inferred from the claim text.