Electronic device and method for manufacturing a semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsu-Nan FANG, Chien-Ching CHEN
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Abstract
An electronic device includes an insulating layer, a metal layer and at least one electrical connecting element. The insulating layer has a top surface and a bottom surface opposite to the top surface, and defines an opening extending between the top surface and the bottom surface. The metal layer is disposed in the opening of the insulating layer and has a top surface and a bottom surface opposite to the top surface. The bottom surface of the metal layer is substantially coplanar with the bottom surface of the insulating layer. The electrical connecting element is attached to the bottom surface of the metal layer through a seed layer.
Claims20
A method for manufacturing a semiconductor package structure, comprising:
- (a) providing a carrier, wherein the carrier has a first surface and defines a plurality of openings on the first surface;
- (a1) forming a release layer in the openings and on the first surface of the carrier;
- (b) forming a conductive material in the openings of the carrier;
- (c) forming a wiring structure on the carrier and the conductive material;
- (d) electrically connecting at least one semiconductor die to the wiring structure;
- (e) forming an encapsulant to cover the at least one semiconductor die;
- (f) removing the carrier;
- and
- (g) reflowing the conductive material.
(canceled)
12-21. (canceled)
Dependencies are inferred from the claim text.