Methods and Apparatus for Package with Interposers

A structure comprising:

• an interposer, the interposer comprising a die attach region, an underfill region, and a connect region, wherein the underfill region includes the die attach region and an area surrounding the die attach region, and wherein the connect region is disposed outside the underfill region;
• a die attached to a first contact pad in the die attach region by a first connector;
• a first dam disposed on the interposer, wherein the first dam surrounds the underfill region;
• underfill disposed in the underfill region, the underfill surrounding the first connector;
• and
• a package attached to the interposer by a second connector in the connect region of the interposer, a bottom surface of the package contacting a top surface of the die.

A structure comprising:

• an interposer comprising:
• a semiconductor layer,
• an interconnect structure disposed over the semiconductor layer, the interconnect structure having a first metal layer, and
• a first contact pad, a second contact pad, and a first dam disposed over the interconnect structure, each of which being physically coupled to the first metal layer of the interconnect structure, the first contact pad being disposed within the first dam, the second contact pad being disposed outside the first dam.