Method and system for thermal control of devices in an electronics tester

A tester apparatus comprising:

• a frame defining at least a first closed loop air path;
• at least a first fan located in the first closed loop air path to recirculate air through the first closed loop air path;
• a plurality of slot assemblies, each slot assembly including:
• a slot assembly body mounted to the frame;
• a holder mounted to the slot assembly body and forming a testing station for placement of a respective wafer, the respective wafer having at least one microelectronic device and being held in the first closed loop air path;
• and
• a plurality of electrical conductors;
• a temperature modification device mounted to the frame in the first closed loop air path, which, when operated causes a transfer of heat between the air in the first closed loop air path and the temperature modification device in the first closed loop air path;
• at least one temperature detector detecting a temperature;
• a thermal controller that controls the transfer of heat based on the temperature;
• a power supply connected through the electrical conductors to the wafers in the testing stations and providing at least power to each microelectronic device;
• and
• a tester connected through the electrical conductors to the wafers and measuring a performance of the microelectronic device.

A method of testing microelectronic devices comprising:

• placing a respective wafer of a plurality of wafers, each having at least one microelectronic device, in a respective testing station provided by a respective holder of a respective slot assembly mounted to a frame, the wafers being held in a first closed loop air path defined by the frame;
• operating at least a first fan located in the first closed loop air path to recirculate air through the first closed loop air path;
• transferring heat between at least one temperature modification device mounted to the frame in the first closed loop air path and the air in the first closed loop air path;
• detecting a temperature;
• controlling the transfer of heat based on the temperature;
• and
• testing the microelectronic devices by providing at least power to each microelectronic device and measuring a performance of the microelectronic device.